Led by laser and motion experts, explore the latest advances in laser drilling of VIA holes — key to enabling higher bandwidth communication and compact device footprints. Attendees will gain insight into methods for overcoming core challenges through fixed-optic configurations, advanced motion control, and laser-to-motion synchronization.
Matt Price (PI’s Head of Agile Solutions Group), Mark Turner (CEO and Founder of Turner Laser Systems), and Jason Goerges (ACS Motion Control’s VP Marketing) will share real-world examples, including glass wafer drilling, illustrate how these solutions deliver results. To conclude, we’ll preview emerging innovations — such as XL SCAN, 3D error correction, and hybrid piezo motion — that hint at the future potential for even faster and more accurate manufacturing.
Title: Latest Advances in Laser Drilling of VIA holes
Date: July 17, 2025
Time: 2:00 pm (ET)
Register now to secure your spot!
Industries Served
Semiconductor, photonics, optics, medical device manufacturing
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